We have a new process that allows us to wire bond many devices at ambient temperature. This allows gold ball wire bonding to parts that are heat sensitive such as gold plated plastic, magnetic structures, populated PCB’s, etc.

Our wire bonding service utilizes a manual digital ball bonder. Bondable substrates include platinum, gold and aluminum. Copper can be bonded on a prototype and small volume basis but is not considered a permanent solution. We specialize in small batch processing and are experienced with unusual wire bonding applications.

To learn more about how Advanced International Technology can assist your organization with high-precision micro assembly and wire bonding services, please call us at +1 858-566-2945 or submit an inquiry via our web form.

Advanced International Technology provides custom micro assembly services, including precision wire bonding, wedge bonding, ball bonding and aluminum bonding.

AI Technology serves clients throughout San Diego, Chula Vista, National City, Mission Valley, Miramar, Mira Mesa, San Jose & San Francisco, CA and surrounding cities.



Contact our experts today for more information about our dicing and assembly services.


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